COOLER MASTER High Performance Thermal Compund Kit

Features:
-Suitable for CPU chipsets on Mainboard, VGA card, etc
-Easy to use
-Zif Socket Templates ensure correct applying area with various CPU socket types
-Produces an even layer when using applicator
-Dielectric
-Wide range of application temperature

Specification:
HTK-002-U1 Cooler Master High Performance Thermal Compound Kit
-Color : White
-Viscosity/Flowability : Nonflowing
-Specific Gravity (cured) : 2.37
-Dielectric Constant : 4.4 at 100kHz
-Volume Resistivity : 5.0 x 10 power of 15
-Dissipation Factor : 0.02 at 100kHz
-Dielectric Strength : 550 volts/mil; 21.7 kV/mm
-Thermal Conductivity : 0.8 watts/meter- C.